Latest Whitepapers
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
Load cell use in aerospace ground and flight test applications
The use of load cells is prevalent in many aerospace ground and flight test applications. In considering...
MEMORY MODULE SERIAL PRESENCE DETECT (SPD)
For a computer system to recognize a memory module, the module needs to have a chip on it that communicates...
XP Tips and Tricks
XP Power offers advice on power supply design, which could help with your next design. Most electronics...
Connecting Peripherals to an Android Platform
This white paper will describe some of the options for connecting peripheral accessories to Android OS...
Impact of Parasitics on Performance
With improvements in switching figure of merit provided by eGaN FETs, the packaging and PCB layout parasitics...
eGaN® FETs in Wireless Power Transfer Systems
The popularity of wireless energy transfer has increased over the last few years and in particular for...
High Pulse Resistors
Resistors used in modern electronics often experience transients (e.g. lighning strike) or pulse loads...
Five Key Elements for Effective IIoT Implementation
Industrial automation exists within a broader technological framework and has benefitted from advances...
MEMS Oscillators: Enabling Smaller, Lower Power IoT & Wearables
The explosive growth in Internet-connected devices, or the Internet of Things (IoT), is driven by the...
MORE ETHERNET ON THE HORIZON WHO NEEDS 2.5G AND 5G ETHERNET?
Ethernet seems to be one of the fastest growing transmission protocols ever, on both medium types, fiber...
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