Processors
Top 5 Applications for Inductive Sensors on Packaging Machines
Amid the multitude of advanced technologies being integrated into automated packaging operations today,...
Enabling Next Generation High Density Power Conversion
The drive to create Metadata processing server systems plus the parallel push for increased port density...
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
NEW APPROACHES TO HARDWARE ACCELERATION USING ULTRA LOW DENSITY FPGAs
Ask system designers to list the problems they face – it doesn't matter whether they're building mobile...
2:1 MIPI CSI-2 Bridge Soft IP
In some cases, mobile Application Processors (AP) may not have enough interfaces to support the number...
SynJet: Low-Power “Green” Cooling
The realities of finite petroleum resources and growing global energy needs along with the confidence...
Ball vs. Sleeve: A Comparison In Bearing Performance
As consumers demand smaller, faster computer systems, OEM design engineers race to create systems with...
AURIX™ as a safety controller and ISO 13849
Benefit from the experts of the AURIX™ Preferred Design House and download our white paper! Infineon's...
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